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asteralabs

29 days ago

Expert IC Package Design Lead

Onsite · Israel Israel

compute connectivity engineering 2

greenhouse

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AI TL;DR

You will lead the design of advanced IC packaging solutions for high-performance connectivity silicon in Israel. This role involves significant product ownership and collaboration with various engineering teams to optimize performance for AI applications.

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Job description

You will lead the design of advanced IC packaging solutions for high-performance connectivity silicon in Israel. This role involves significant product ownership and collaboration with various engineering teams to optimize performance for AI applications.

Details

  • Israel, on-site work
  • 10+ years of experience
  • Expert proficiency in IC package design tools

The work

  • Own end-to-end IC package design from concept to production
  • Define package architecture and technology selection
  • Lead signal integrity, power integrity, and thermal considerations
  • Collaborate with silicon design and manufacturing partners